Product qualification report irf3205s infineon technologies. Pictures have been added to enhance the fail mode diagrams. Jesd22 a104d ixz650 jesd22 b103b jesd22 a1f jesd22 a108c qfn shipping trays jesd22 a101c invensense mems gyroscope d 3axis digital gyroscope sensor text. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Applications general purpose switching and amplification, e. Acceptable alternative test conditions and temperature tolerances are a through h, i, l, or m as defined in table 1 of jesd22 a104, temperature cycling. Jesd22a104b revision of jesd22a104a july 2000 jedec solid state technology association. The sample size of the mm esd test at each pin combination should be equal to, or greater than 3 devices of the specified lot 4, 5. Reliability evaluation test test item test condition failure identification package sample size number of failure precondition jesd22a1d 125. Ed mello 010995 b 0815 022396 extensively revised and updated to eia. Jedec jesd22 a1i preconditioning of nonhermetic surface mount devices prior to reliability testing. Electronic industries alliance standards and engineering publications jedec, solid state technology product code 5 to order call. Jesd22a105c40 to 85c, 40 to 125c devices power and temperature cycling c7 jedec pwb coupons ipctm650 2. Pdf jesd22a115b, jesd78b av265 jesd22b116a, eiajesd22a110b, eiajesd22a102c, 168hrs jesd22a1 jesd22a114f jesd47 jesd47 jedec jesd22b116 free download jesd22a102c jesd22a108b jesd22.
Preconditioning tests oneida research services, inc. Different heatingcooling systems can be selected based on needed performance. The airtoair thermal shock test is jesd22a104d temperature cycling the liquidtoliquid thermal shock test is jesd22a106b thermal shock milstd 883. Jesd22a104c,jedecstandardtemperaturecyclingjesd22a104crevisionofjesd22a104bmay2005jedecsolidstatetechnologyassociation. Despite more than five decades of research on tin whiskers, there is no consensus on the. Machine model mm as described in jesd22a115 should not be used as a requirement for. The unbiased hast is performed for the purpose of evaluating the reliability of nonhermetic packaged solidstate devices in humid environments. Therefore, it is recommended that the package temperature at the top center of. Our website provide pdf immediately download,sometimes when you purchased cant online download please contact us,we will send the document to you with email. Jesd22a118 c, 85% rh, unbiased 96 hr 3 x 025 temperature humidity bias thb jesd22a101 85c, 85% rh, biased hr 3 x 025 highly accelerated stress test hast jesd22a110 c, 85% rh, biased 96 hr 3 x 025 high temperature storage test htsl jesd22a103 150c hr 3 x 025 high temperature operating life htol jesd22a108 150c.
The jesd22 group of specifications include temperaturehumidity, thermal shock, and hast. Find out more about the benefits of participating in the development of jedec standards jedec committees develop open standards, which are the basic building blocks of the digital economy and form the bedrock on which healthy, highvolume markets are built. The ets thermal shock series is available in two sizes. Jesd22a1 datasheet, cross reference, circuit and application notes in pdf format. Qualification summary machxo2 product family octopart. The material in this test method has been supeceded by js0022018. Milstd883g iec 60749 iec 600682 jesd22 eiaj ed4701 1 esd hbm ta25.
New jesd 47 revision i released for stresstestdriven. Jesd22a117 10412007 pchtdr ta 150c 3 039 cycles per nvce. Jesd22 a1 preconditioning procedures of plastic surface mount devices prior to reliability. Machine model mm as described in jesd22 a115 should not be used as a requirement for integrated circuit esd qualification. Jesd22a106 ramp rate 2 min cycling condition as below. In the case of direct transfer of a device from aizu to cz4, the letter a will be added to the opn to identify parts from the new wafer fab. This test method establishes an industry standard preconditioning flow for nonhermetic solid state smds surface mount devices that is representative of a typical industry multiple solder reflow operation. Automating solder reflow simulation per ipcjedec jstd.
Inquiries, comments, and suggestions relative to the content of this eiajedec standard or publication should be addressed to jedec solid state technology association, 2500 wilson boulevard, arlington, va 2220834, 70390775607559 or. Ed mello 082093 a 0403 120994 update spec to latest requirements. A114f method 304 to evaluate the endurance of a semiconductor device to human body model electrostatic discharges while the semiconductor device is handled until mounting into electronic equipment. The material in this test method has been supeceded by js0022018, published january 2019. Dependin g on the thermal capacity, an appropriate condition in the range of 10 to 15. Solid state technology jedec standardsand engineering. Santa clara, ca 95052 121 ti blvd, dallas, tx 75243 abstractto enable the widespread adoption of gan products, the industry needs to be convinced of productlevel reliability. Jesd22a110 highlyaccelerated temperature and humidity.
Jedec jesd22a114f electrostatic discharge esd sensitivity testing human body model hbm standard by jedec solid state technology association. Jesd22 a104b revision of jesd22 a104a july 2000 jedec solid state technology association. Jesd22a1f is the test method that establishes an industry standard. High temperature storage life htsl jesd22 a103 low temperature storage life ltsl jesd22 a119 high temperature operating life htol jesd22 a108 low temperature operating life ltol jesd22 a119 board level drop test jesd22 b111 mechanical shock jesd22 b110 vibration test jesd22 b103 lead integrity test jesd22. The effect of ramp rate on temperature cycle fatigue in. Jesd 625b archives document centers standards forum. Rtg4 reliability and qualification microsemi space forum 2015 dr. The test is applicable for evaluation, screening, monitoring, andor qualification of all solid state devices. Jesd22a1 preconditioning of nonhermetic surface mount. Msl 1 conditions that comply with jesd22a1f, preconditioning of. Ramp rate should be measured for the linear portion of the profile curve, which is generally the range. Jedec jesd22 a114f electrostatic discharge esd sensitivity testing human body model hbm standard by jedec solid state technology association, 12012008. Esd22a106 testmethod a106a thermal shock from counc cb94 51 summarypage esd22a106 testmethod a106a thermal shock purposethi mine posur posur 1. Electrical tests test name reference standard test conditions units tested units failed esd jesd22 a114 2kv human body model 3pin combination 0 jesd22 a115 200v machine model 3pin.
Dc current induced thermal cycle c6 ipc no pwb spec for wet thermal shock, though some use reported. Jesd22 a104b temperature cycling, milstd 202 method 107g version f or later, or similar tests. Pericom semiconductor corporation document control specification specification no qa1420 rev. Acceptable alternative test conditions and temperature tolerances are a through h, i, l, or m as defined in table 1 of jesd22a104, temperature cycling. The effect of ramp rate on temperature cycle fatigue in solder joints the ramp rate of 15. Low temperature operating life ltol jesd22a119 board level drop test jesd22b111 mechanical shock jesd22b110 vibration test jesd22b103 lead integrity test jesd22b105 solder heat milstd750 zyglo dye penetration test solderability jesd22b102. Jesd22a104b temperature cycling, milstd 202 method 107g version f or later, or similar tests. Jesd22a101 jesd22a102 transistor a102 jesd22a119 jesd22b106 jesd22a104 a9273 a102 transistor jesd22a101 text. This standard requires smds to be reflowed three 3 times and then evaluated for quality compliance. Thermal shock guide resource center espec north america. Jul 25, 2012 jedec has just released the new jesd 47 revision i, stresstestdriven qualification of integrated circuits, and its available now from document center inc.
Bahl, daniel ruiz and dong seup lee texas instruments 2900 semiconductor dr. Componen ts jesd22a106c wet thermal shock c5 jedec very widely used atc test for fixtured and soldered. Ti information nda required feature jesd204 jesd204a jesd204b introduction of standard 2006 2008 2011 maximum lane rate 3. Please read the important notice and warnings at the end of this document. Note for good correlation of results between moisturereflowindu ced stress sensitivity testing per jstd020 and jesd22 a1 and actual reflow conditions used, identical temperature measurements by both the smd manufacturer and the board assembler are necessary. Date revision history approved by date 0032 062293 initiate specification. Tin whisker management guidelines by joe smetana and ron gedney thursday, 01 december 2005 although full understanding of whisker growth is lacking, these specifications and practices will reduce risks. Electrical tests test name reference standard test conditions units tested units failed esd jesd22a114 2kv human body model 3pin combination 0 jesd22a115 200v machine model 3pin.
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